Ceramic Leadless Chip Carrier Socket

A premolded plcc was originally released in 1976 but did not see much market adoption.

Ceramic leadless chip carrier socket.

Heat sinks also available in six sizes. Castellations instead external leads. Leadless chip carrier sockets. The chip is held into the socket by friction.

Leadless chip carriers are ideal for surface mount applications. Gold or solder dip. A plastic leaded chip carrier plcc has a rectangular plastic housing it is a reduced cost evolution of the ceramic leadless chip carrier clcc. A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing.

Solder glass or epoxy seal. 28 44 52 68 84 and 124. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Footprint compatible with cqjb and plcc.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Variety of body sizes. Heat sinks also available in six sizes.

28 44 52 68 84 and 124. Leadless chip carrier sockets conform to jedec standards a b c and d. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Surface mount and soldertail options are available.

Socket or surface mount package. Leadless chip carrier sockets conform to jedec standards a b c and d. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact. Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself.

Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. Surface mount and soldertail options are available. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc.