Ceramic Hybrid Ic Packaging

Co 2 lasered ceramic with matching window frame.

Ceramic hybrid ic packaging.

0 010 pad spacing matches ic sensor. At the same time the vacuum tight housings and substrates must. A multi chip module mcm is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ics or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger ic. Transistors diodes or monolithic ics and passive components e g.

Plated holes enabling multiple conductor levels. A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. 0 100 double row edge pinout.

Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Resistors inductors transformers and capacitors bonded to a substrate or printed circuit board pcb. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the pcb. Ic or integrated circuit packaging refers literally to the material that contains a semiconductor device.

Mechanical integrity provided by using shoulder pins. Twenty mil thick ultra. In support of our defense customers we are an itar registered facility accredited trusted supplier and dla mil prf 38535 certified assembly mfg. Circular and slotted holes allow mechanical positioning.

Packaging and electronic assembly criteria labs offers a full array of ic packaging services from wafer dicing to assembly of gaas gan rf modules and high temperature mcm s.