Ceramic Bga Reliability

A small tape based plastic bga package with 280 balls was included in the study 16 x 16 mm 0 8 mm pitch 9 x 9 depopulated center.

Ceramic bga reliability.

Substrate based ball grid array bga flip chip bga quad flat leadless stacked chip scale flip chip csp xuejun fan moisture related reliability xuejun fan lamar edu higher performance smaller size cheaper price chip scale and wafer level packaging csp wlp. Incoming pcb requirements for cbga freescale semiconductor. Ball grid array bga assembly reliability jpl nepp presentation ipc 9701 csp thermal cycle created date. The cookies we use can be categorized as follows.

Ceramic ball grid array packaging assembly reliability freescale semiconductor. In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. In addition the utilized ceramic ball grid array cbga. Ceramic plates and printed circuit boards pcb to assess solder wetting.

Assemblies with water soluble flux were cleaned in an electrovert h500. Large number of vias within area of bga increases cte locally. Shih et al reliability of hitce ceramic bga packages to be published 2005. Lower cte may be used to increase reliability.

Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. Balls for this package are 90 pb and 10 sn and attached to the ceramic substrate using eutectic 63sn 37pb solder paste. Type 1 ceramic and plastic bga packages with nearly 300 i os. Flip chip cbga is a common package for high end microprocessor devices.

Bga package component reliability after long term storage r. Type 2 ceramic and plastic bga packages with nearly 600 i os. Madsen abstract the white paper component reliability after long term storage texas instruments application. Also utilized was a 256 leaded and a 256 plastic bga package for evaluating and directly comparing manufacturing robustness and reliability.