Ceramic Bga Package

Ceramic substrate 10sn 90pb solder balls 63sn 37pb solder ball to substrate attach 97pb 3sn c4 joint 0 89 mm solder ball for 1 27 mm pitch 1 27 mm pitch c4 c.

Ceramic bga package.

A square or rectangular array of solder balls on one surface ball spacing typically 1 27 mm 0 050 in land grid array lga. Amkor flip chip bga fcbga packages are assembled around state of the art single unit laminate or ceramic substrates. An array of bare lands only. Package outline material information.

Similar to in appearance to qfn but mating is by spring pins within a socket rather than solder. In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. Ceramic ball grid array package drawings bg view more. Having a very high melting point this type bga requires c4 approach controlled collapse chip connection for making the bridge between bgas and pcbs.

Cbga ceramic ball grid array. Available in the following packages. Apply localized heat to bga package. The bga is descended from the pin grid array pga which is a package with one face covered or partly covered with pins in a grid pattern which in operation conduct electrical signals between the integrated circuit and the printed circuit board pcb on which it is placed.

Csp bga chip scale bc ca chip scale package ball grid array package drawings bc ca view more. Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. Ceramic bga packages also work well with flip chips in general. In a bga the pins are replaced by pads on the bottom of the package each initially with a tiny solder ball stuck to it.

Utilizing multiple high density routing layers laser drilled blind buried and stacked vias and ultra fine line space metallization fcbga substrates have the highest routing density available. As the name implies this is ceramic type bga. Fcbga flip chip bp flipchip ball grid array package drawings bp view. The ration between tin and lead is 10 90 in this type.

Ball grid array bga. 32 ball ceramic bga 6 85mm x 6 85mm x 3 8mm bg 32 3 pdf.